Milestone note Jun 10, 2026
Bechtel to build Micron's $100B New York megafab
Micron selected Bechtel as the EPC contractor for the first phase of its $100B semiconductor megafab in Clay, NY — advancing the project toward vertical construction in 2026, with operations targeted for 2030.
Micron selected Bechtel as the EPC contractor for the first phase of its $100B semiconductor megafab in Clay, NY — advancing the project toward vertical construction in 2026, with operations targeted for 2030.
Who's involved
US memory maker; competes with SK hynix and Samsung in DRAM, NAND and HBM.
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